Question E6E11
From subelement E6 - E6E
E6E11
Answer: DWhat is a characteristic of DIP packaging used for integrated circuits?
AExtremely low stray capacitance (dielectrically isolated package)
BExtremely high resistance between pins (doubly insulated package)
CTwo chips in each package (dual in package)
DTwo rows of connecting pins on opposite sides of package (dual in-line package)